3D-Micromac, has announced new developments with its laser micromachining solutions used in magnetic sensors, microLEDs, manufacturing power devices, and in semiconductor advanced packaging.    “Since the first working laser was developed more than 60 years ago, lasers have been used in a wide array of industrial markets. Within the semiconductor industry, lasers play many roles, from wafer dicing, drilling, and patterning,” said 3D-Mircomac CEO Uwe Wagner. “As the leading specialist in laser ...